Spectra7 Microsystems (SPVNF) Starts Presentation at LD Micro Conference

Spectra7 Microsystems (OTC: SPVNF) makes the electronic products we use every day dramatically thinner, lighter and higher performance. These products include ultra-thin 4K Panels, ultra HD displays, head-mounted displays for both Virtual Reality and Augmented Reality, Drones and Data Centers. Significantly thinner data and information conduits are achieved by addressing the electro-magnetic interference (EMI), signal loss, reflections and crosstalk in these platforms with Spectra7’s analog chip technology; as opposed to the traditional technique of mechanical shielding, thicker conduits containing more copper, or expensive, bulky connectors. Spectra7’s technology can enable the removal of as much as 90% of the bulk and metal traditionally needed to maintain signal integrity amidst these signal impairments. For more information, visit the company’s website at www.spectra7.com